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  2sj387(l), 2sj387(s) silicon p-channel mos fet application high speed power switching features low on-resistance low drive current 2.5 v gate drive device can be driven from 3 v source suitable for switching regulator, dc - dc converter outline 1 2 3 1 2 3 4 4 dpak-2 1. gate 2. drain 3. source 4. drain d g s
2sj387(l), 2sj387(s) 2 absolute maximum ratings (ta = 25?) item symbol ratings unit drain to source voltage v dss ?0 v gate to source voltage v gss 10 v drain current i d ?0 a drain peak current i d(pulse) * 1 ?0 a body to drain diode reverse drain current i dr ?0 a channel dissipation pch* 2 20 w channel temperature tch 150 c storage temperature tstg ?5 to +150 c notes: 1. pw 10 m s, duty cycle 1 % 2. value at tc = 25 c
2sj387(l), 2sj387(s) 3 electrical characteristics (ta = 25?) item symbol min typ max unit test conditions drain to source breakdown voltage v (br)dss ?0 v i d = ?0 ma, v gs = 0 gate to source breakdown voltage v (br)gss 10 v i g = 200 m a, v ds = 0 gate to source leak current i gss 10 m av gs = 6.5 v, v ds = 0 zero gate voltage drain current i dss ?00 m av ds = ?6 v, v gs = 0 gate to source cutoff voltage v gs(off) ?.5 ?.5 v i d = ? ma, v ds = ?0 v static drain to source on state resistance r ds(on) 0.05 0.07 w i d = ? a v gs = ? v* 1 0.07 0.1 w i d = ? a v gs = ?.5 v* 1 forward transfer admittance |y fs | 7 12 s i d = ? a v ds = ?0 v* 1 input capacitance ciss 1170 pf v ds = ?0 v output capacitance coss 860 pf v gs = 0 reverse transfer capacitance crss 310 pf f = 1 mhz turn-on delay time t d(on) 20 ns i d = ? a rise time t r 325 ns v gs = ? v turn-off delay time t d(off) 350 ns r l = 2 w fall time t f 425 ns body to drain diode forward voltage v df ?.0 v i f = ?0 a, v gs = 0 body to drain diode reverse recovery time t rr 240 ns i f = ?0 a, v gs = 0, dif/dt = 20 a/ m s note: 1. pulse test
2sj387(l), 2sj387(s) 4 40 30 20 10 0 channel dissipation pch (w) 50 100 150 200 case temperature tc (?) power vs. temperature derating drain to source voltage v (v) ds drain current i (a) d maximum safe operation area ?00 ?0 ?0 ? ? ?.3 ?.1 ?.5 ? ? ? ?0 ?0 ?0 ta = 25 ? pw = 10 ms (1shot) operation in this area is limited by r ds(on) 1 ms 10 ? 100 ? dc operation (tc = 25 ?) ?0 ?6 ?2 ? ? 0 drain to source voltage v (v) ds drain current i (a) d typical output characteristics ? ? ? ? ?0 v = ?.5 v gs pulse test ?.5 v ? v ?0 v ? v ? v ?0 ? ? ? ? 0 gate to source voltage v (v) gs drain current i (a) d typical transfer characteristics tc = ?5 ? 75 ? 25 ? v = ?0 v pulse test ds ? ? ? ? ?
2sj387(l), 2sj387(s) 5 ?.5 ?.4 ?.3 ?.2 ?.1 0 gate to source voltage v (v) gs drain to source saturation voltage vs. gate to source voltage v (v) ds(on) drain to source saturation voltage ? ? ? ? ?0 pulse test d i = ? a ? a ? a drain current i (a) d drain to source on state resistance r ( ) w ds(on) static drain to source on state resistance vs. drain current 1 0.2 0.5 0.1 0.01 0.02 0.05 ?.5 ? ? ? ?0 ?0 ?0 ? v pulse test v = ?.5 v gs 0.2 0.16 0.12 0.08 0.04 ?0 0 40 80 120 160 case temperature tc (?) 0 r ( ) ds(on) static drain to source on state resistance w static drain to source on state resistance vs. temperature pulse test ? v d i = ? a ?, ? a gs v = ?.5 v ? a ? a ? a drain current i (a) d forward transfer admittance |y | (s) fs forward transfer admittance vs. drain current 50 20 10 2 5 1 0.5 ?.1 ?.2 ?.5 ? ? ? ?0 tc = ?5 ? 75 ? 25 ? v = ?0 v pulse test ds
2sj387(l), 2sj387(s) 6 reverse drain current i (a) dr reverse recovery time trr (ns) body to drain diode reverse recovery time ?.1 ?.3 ? ? ?0 ?0 ?00 1000 200 500 100 20 50 10 di / dt = 20 a / s v = 0, ta = 25 c gs 0 ?0 ?0 ?0 ?0 ?0 capacitance c (pf) drain to source voltage v (v) ds typical capacitance vs. drain to source voltage 10000 2000 5000 1000 200 500 100 ciss coss crss v = 0 f = 1 mhz gs 0 ?0 ?0 ?0 ?0 0 gate charge qg (nc) drain to source voltage v (v) ds 0 ? ? ?2 ?6 ?0 ?0 gate to source voltage v (v) gs dynamic input characteristics 20 40 60 80 100 ds v gs v v = ? v ?0 v ?5 v dd d i = ?0 a v dd = ? v ?0 v ?5 v drain current i (a) d switching time t (ns) switching characteristics 1000 200 500 100 20 50 10 ?.1 ?.3 ? ? ?0 ?0 ?00 d(off) t v = ? v, v = ?0 v pw = 5 ?, duty < 1 % gs dd t f r t d(on) t
2sj387(l), 2sj387(s) 7 ?0 ?6 ?2 ? ? 0 source to drain voltage v (v) sd reverse drain current i (a) dr reverse drain current vs. source to drain voltage ?.4 ?.8 ?.2 ?.6 ?.0 pulse test ? v ? v v = 0, 5 v gs 3 1 0.3 0.1 0.03 0.01 10 100 1 m 10 m pulse width pw (s) normalized transient thermal impedance 100 m 1 10 s (t) g dm p pw t d = pw t ch ?c(t) = s (t) ? ch ?c ch ?c = 6.25 ?/w, tc = 25 ? q g q q d = 1 0.5 0.2 0.01 0.02 0.1 0.05 1 shot pulse tc = 25? normalized transient thermal impedance vs. pulse width
2sj387(l), 2sj387(s) 8 vin monitor d.u.t. vin ? v r l v = ?0 v dd tr td(on) vin 90% 90% 10% 10% vout td(off) vout monitor 50 w 90% 10% t f switching time test circuit waveforms
hitachi code jedec eiaj weight (reference value) dpak (l)-(2) 0.42 g unit: mm 6.5 0.5 2.3 0.2 0.55 0.1 1.2 0.3 0.55 0.1 5.5 0.5 1.7 0.5 16.2 0.5 4.7 0.5 5.4 0.5 1.15 0.1 2.29 0.5 2.29 0.5 0.8 0.1 0.55 0.1 3.1 0.5 (0.7)
cautions 1. hitachi neither warrants nor grants licenses of any rights of hitachi? or any third party? patent, copyright, trademark, or other intellectual property rights for information contained in this document. hitachi bears no responsibility for problems that may arise with third party? rights, including intellectual property rights, in connection with use of the information contained in this document. 2. products and product specifications may be subject to change without notice. confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. hitachi makes every attempt to ensure that its products are of high quality and reliability. however, contact hitachi? sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. design your application so that the product is used within the ranges guaranteed by hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail- safes, so that the equipment incorporating hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the hitachi product. 5. this product is not designed to be radiation resistant. 6. no one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from hitachi. 7. contact hitachi? sales office for any questions regarding this document or hitachi semiconductor products. hitachi, ltd. semiconductor & integrated circuits. nippon bldg., 2-6-2, ohte-machi, chiyoda-ku, tokyo 100-0004, japan tel: tokyo (03) 3270-2111 fax: (03) 3270-5109 copyright ? hitachi, ltd., 1999. all rights reserved. printed in japan. hitachi asia pte. ltd. 16 collyer quay #20-00 hitachi tower singapore 049318 tel: 535-2100 fax: 535-1533 url northamerica : http:semiconductor.hitachi.com/ europe : http://www.hitachi-eu.com/hel/ecg asia (singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm asia (taiwan) : http://www.hitachi.com.tw/e/product/sicd_frame.htm asia (hongkong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm japan : http://www.hitachi.co.jp/sicd/indx.htm hitachi asia ltd. taipei branch office 3f, hung kuo building. no.167, tun-hwa north road, taipei (105) tel: <886> (2) 2718-3666 fax: <886> (2) 2718-8180 hitachi asia (hong kong) ltd. group iii (electronic components) 7/f., north tower, world finance centre, harbour city, canton road, tsim sha tsui, kowloon, hong kong tel: <852> (2) 735 9218 fax: <852> (2) 730 0281 telex: 40815 hitec hx hitachi europe ltd. electronic components group. whitebrook park lower cookham road maidenhead berkshire sl6 8ya, united kingdom tel: <44> (1628) 585000 fax: <44> (1628) 778322 hitachi europe gmbh electronic components group dornacher strae 3 d-85622 feldkirchen, munich germany tel: <49> (89) 9 9180-0 fax: <49> (89) 9 29 30 00 hitachi semiconductor (america) inc. 179 east tasman drive, san jose,ca 95134 tel: <1> (408) 433-1990 fax: <1>(408) 433-0223 for further information write to:


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